To promote international collaboration in the field of Education and Academic Research
Mysuru: Vidya Vikas Institute of Engineering & Technology (VVIET), Mysuru and Indian Printed Circuit Board Association (IPCA), signed a Memorandum of Understanding (MoU) on Feb.19 to promote international collaboration in the field of Education and Academic Research on the occasion of one-day National Seminar on “Emerging Trends in PCB Design, Manufacturing and Assembly Technology” conducted by VVIET in association with ESSCI and IPCA.
