In recent times, electronic industry has exceptionally impressed upon the human fraternity with its faster growing technologies and products having multi-tasking capabilities. Also miniaturisation of electronics has exponentially increased over the years and advanced fabrication techniques has helped to bring it into reality.
Due to its miniaturisation there is a reduction in heat transfer area which results in huge accumulation of heat which may lead to the failure of the component. The heat flux of the microprocessors and memory devices are reaching the order of KW/cm2 in the near future which requires new novel cooling technologies which increases its life span.
